The ongoing shrinkage in the size of two-dimensional (2D) electronic circuitry results in high power densities during device operation, which could cause a significant temperature rise within 2D channels. One challenge in Raman thermometry of 2D materials is that the commonly used high-frequency modes do not precisely represent the temperature rise in some 2D materials because of peak broadening and intensity weakening at elevated temperatures. In this work, we show that a low-frequency E2g2 shear mode can be used to accurately extract temperature and measure thermal boundary conductance (TBC) in back-gated tungsten diselenide (WSe2) field-effect transistors, whereas the high-frequency peaks (E2g1 and A1g) fail to provide reliable thermal information. Our calculations indicate that the broadening of high-frequency Raman-active modes is primarily driven by anharmonic decay into pairs of longitudinal acoustic phonons, resulting in a weak coupling with out-of-plane flexural acoustic phonons that are responsible for the heat transfer to the substrate. We found that the TBC at the interface of WSe2 and Si/SiO2 substrate is ∼16 MW/m2 K, depends on the number of WSe2 layers, and peaks for 3-4 layer stacks. Furthermore, the TBC to the substrate is the highest from the layers closest to it, with each additional layer adding thermal resistance. We conclude that the location where heat dissipated in a multilayer stack is as important to device reliability as the total TBC.

Two-dimensional (2D) materials have tremendous potential for next-generation nano- and opto-electronics [1], [2]. However, heat dissipation and its removal from hot spots in the monolayer remains a critical concern to the design of 2D-based devices [2], [3]. Thermal currents flowing in a atomic layer can either dissipate through source/drain contacts, as in a transistor configuration, or through a supporting substrate via van der Waals (vdW) coupling to it. When a 2D mateiral is supported by a substrate, the interfacial area formed between it and the substrate is often far larger than the lateral source/drain contact area. Thus, it is suspected that the majority of waste heat is removed across the 2D-substrate interface and then via the substrate. Therefore, it is imperative that the thermal boundary conductance (TBC) between the 2D layer and substrate be well characterized for reliable 2D device performance. Herein we tackle the question of selecting the best substrate for each 2D material from the point of view of heat dissipation.

We study the impact of grain boundaries (GB) and misorientation angles between grains on electronic transport in 2-dimensional materials. Here we have developed a numerical model based on the first-principles electronic bandstructure calculations in conjunction with a method which computes electron transmission coefficients from simultaneous conservation of energy and momentum at the interface to essentially evaluate GB/interface resistance in a Landauer formalism. We find that the resistance across graphene GBs vary over a wide range depending on misorientation angles and type of GBs, starting from 53 Ω μm for low-mismatch angles in twin (symmetric) GBs to about 1020 Ω μm for 21° mismatch in tilt (asymmetric) GBs. On the other hand, misorientation angles have weak influence on the resistance across MoS2 GBs, ranging from about 130 Ω μm for low mismatch angles to about 6000 Ω μm for 21°. The interface resistance across graphene-MoS2 heterojunctions also exhibits a strong dependence on misorientation angles with resistance values ranging from about 100 Ω μm for low-mismatch angles in Class-I (symmetric) interfaces to 1015 Ω μm for 14° mismatch in Class-II (asymmetric) interfaces. Overall, symmetric homo/heterojunctions exhibit a weak dependence on misorientation angles, while in MoS2 both symmetric and asymmetric GBs show a gradual dependence on mismatch angles.

We study the impact of grain boundaries (GB) and misorientation angles between grains on electronic transport in 2-dimensional materials. Here we have developed a numerical model based on the first-principles electronic bandstructure calculations in conjunction with a method which computes electron transmission coefficients from simultaneous conservation of energy and momentum at the interface to essentially evaluate GB/interface resistance in a Landauer formalism. We find that the resistance across graphene GBs vary over a wide range depending on misorientation angles and type of GBs, starting from 53 Ω μm for low-mismatch angles in twin (symmetric) GBs to about 1020 Ω μm for 21° mismatch in tilt (asymmetric) GBs. On the other hand, misorientation angles have weak influence on the resistance across MoS2 GBs, ranging from about 130 Ω μm for low mismatch angles to about 6000 Ω μm for 21°. The interface resistance across graphene-MoS2 heterojunctions also exhibits a strong dependence on misorientation angles with resistance values ranging from about 100 Ω μm for low-mismatch angles in Class-I (symmetric) interfaces to 1015 Ω μm for 14° mismatch in Class-II (asymmetric) interfaces. Overall, symmetric homo/heterojunctions exhibit a weak dependence on misorientation angles, while in MoS2 both symmetric and asymmetric GBs show a gradual dependence on mismatch angles.